Fairchild Semiconductor
74ACT74PC
Dual D-Type Positive Edge-Triggered Flip-Flop

Qualification Data

Fairchild Product Reliability Report

     Contact your regional quality and reliability representative with any questions on product qualification support.

    Test Standards:

  • Moisture Sensitivity: NA
  • Physical Dimensions: DIP
space



AttributeValue
General Information
Device Marking(TOP MARK)$Y&Z&4&K
74ACT74PC
Family Code08C
Package TypeDIP
Package Description014,PLASTIC, MOLDED DIP
Pin Count14
FIT2.5
Maximum Reflow TemperatureNA (thru hole)
MSL RatingNA (thru hole)|
Restriction of Hazardous Substance
Standard Plating FinishMatte Sn
Base Metal/Leadframe MaterialCopper,Iron,Phosphorus,Zinc,Silver
Package Assembly*
Plating Finish Layer Thickness8.0um - 13um
Moisture SensitivityNA
Wire MaterialAu
Wire Diameter1.0 MIL
UL Flammability RatingUL94-V0
DAP Size80X80 MIL
Frame MaterialCu
Die Attach TypeEpoxy / Poly 6

*If an attribute is listed twice, either can be used on the part.

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