| 74VHC273SJ
Octal D-Type Flip-Flop |
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Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | $Y&Z&2&K
VHC273 | |
| Family Code | 08P | |
| Package Type | SOP | |
| Package Description | 020,PLAS,MOLDED EIAJ SO | |
| Pin Count | 20 | |
| FIT | 1.9 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance | ||
| Standard Plating Finish | Matte Sn | |
| Die Fabrication | ||
| Fabrication Process Identifier | 8P680C | |
| Package Assembly* | ||
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Moisture Sensitivity | 1 | |
| Electrical Test | ||
| ESD Human Body Model (HBM) | 4000 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| ESD Machine Model (MM) | 400 | V |
| Package Assembly* | ||
| UL Flammability Rating | UL94-V0 | |
| DAP Size | 110X130 MIL | |
| Frame Material | Cu | |
| Die Attach Type | Epoxy / Poly 6 | |
| Wire Material | Au | |
| Wire Diameter | 0.9 MIL | |
*If an attribute is listed twice, either can be used on the part.