| CD4066BCN
Quad Bilateral Switch |
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Qualification Data
|  |
| Attribute | Value |
|---|---|
| General Information | |
| Device Marking(TOP MARK) | $Y&Z&4&K
CD4066BCN |
| Family Code | 086 |
| Package Type | DIP |
| Package Description | 014,PLASTIC, MOLDED DIP |
| Pin Count | 14 |
| FIT | 2.4 |
| Maximum Reflow Temperature | NA (thru hole) |
| MSL Rating | NA (thru hole)| |
| Restriction of Hazardous Substance | |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Iron,Phosphorus,Zinc,Silver |
| Package Assembly* | |
| Plating Finish Layer Thickness | 8.0um - 13um |
| Moisture Sensitivity | NA |
| Wire Material | Au |
| Wire Diameter | 0.9 MIL |
| DAP Size | 80X80 MIL |
| Frame Material | Cu |
| Die Attach Type | Epoxy / Poly 6 |
| UL Flammability Rating | UL94-V0 |
*If an attribute is listed twice, either can be used on the part.