| FAN5350MPX
3MHz 600mA DC/DC Buck Converter in WLCSP and MLP package |
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Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | $Y&Z&2&K
5350 C | |
| Family Code | 0BM | |
| Package Type | MLP | |
| Package Description | 6LD, MLP, JEDEC, MO-229, DUAL, 3MM SQUARE | |
| Pin Count | 6 | |
| FIT | 16.4 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance | ||
| Standard Plating Finish | NiPdAu | |
| Die Fabrication | ||
| Fabrication Process Identifier | NYFS50BC5S | |
| Package Assembly* | ||
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Moisture Sensitivity | 1 | |
| Electrical Test | ||
| ESD Human Body Model (HBM) | 4500 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| ESD Machine Model (MM) | 200 | V |
| Package Assembly* | ||
| DAP Size | 6L | |
| Frame Material | 2.51X1.74MM | |
| Die Attach Type | Epoxy / EN-4620K | |
| Wire Material | Au | |
| Wire Diameter | 1.0 MIL | |
*If an attribute is listed twice, either can be used on the part.