| FAN7710N
Electronic Ballast Control IC |
|||
|
Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | FAN7710
&E&Z&3 | |
| Family Code | 0SB | |
| Package Type | DIP | |
| Package Description | 008,PLASTIC, MOLDED DIP | |
| Pin Count | 8 | |
| FIT | 6.6 | |
| Maximum Reflow Temperature | NA (thru hole) | |
| MSL Rating | NA (thru hole)| | |
| Restriction of Hazardous Substance | ||
| Standard Plating Finish | Matte Sn | |
| Die Fabrication | ||
| Fabrication Process Identifier | HDG4 | |
| Package Assembly* | ||
| Plating Finish Layer Thickness | 8.0um - 18um | |
| Thermal Impedance (Theta JA) | 70 | °C/Watt |
| Thermal Impedance (Theta JC) | 30 | °C/Watt |
| Moisture Sensitivity | NA | |
*If an attribute is listed twice, either can be used on the part.