Fairchild Semiconductor
FAN7711N
Electronic Ballast Control IC

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: NA
  • Thermal Impedance: 36/100
  • Physical Dimensions: DIP
  • ESD HBM: 1000
  • ESD CDM: 500
  • ESD MM: 300
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AttributeValueUOM
General Information
Device Marking(TOP MARK)FAN7711
&E&Z&3
 
Family Code0SB 
Package TypeDIP 
Package Description008,PLASTIC, MOLDED DIP 
Pin Count8 
FIT6.6 
Die Fabrication
Fabrication Process IdentifierHDG4 
Package Assembly*
Thermal Impedance (Theta JA)100°C/Watt
Thermal Impedance (Theta JC)36°C/Watt
Moisture SensitivityNA 
Electrical Test
ESD Human Body Model (HBM)1000V
ESD Charged Device Model (CDM)500V
ESD Machine Model (MM)300V

*If an attribute is listed twice, either can be used on the part.

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