| FDB12N50TM
500V N-Channel MOSFET, UniFET™ |
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|
Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | $Y&Z&3&K
FDB 12N50 | |
| Family Code | 0SQ | |
| Package Type | TO-263(D2PAK) | |
| Package Description | 002, PLASTIC MOLDED, TO-263 PKG, CNTR LD CUT, SMD (45) | |
| Pin Count | 2 | |
| FIT | 12.9 | |
| Die Fabrication | ||
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* | ||
| Thermal Impedance (Theta JA) | 62 | °C/Watt |
| Thermal Impedance (Theta JC) | 1 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test | ||
| ESD Charged Device Model (CDM) | 2000 | V |
| Package Assembly* | ||
| UL Flammability Rating | DPG | |
| Wire Material | AL | |
| Wire Diameter | 12.0 MIL | |
| DAP Size | 246*190MILS | |
| Frame Material | L-BEND | |
| Wire Material | AL | |
| Wire Diameter | 5.0 MIL | |
*If an attribute is listed twice, either can be used on the part.