Fairchild Semiconductor
FDB8443
40V N-Channel PowerTrench MOSFET

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: 1
  • Thermal Impedance: 1/43
  • Physical Dimensions: TO-263(D2PAK)
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AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&3&K
FDB
8443
 
Family Code061 
Package TypeTO-263(D2PAK) 
Package Description002, PLASTIC MOLDED, TO-263 PKG, CNTR LD CUT, SMD (45) 
Pin Count2 
FIT6.5 
Maximum Reflow Temperature260C 
MSL Rating1| 
Restriction of Hazardous Substance
Standard Plating FinishMatte Sn 
Base Metal/Leadframe MaterialCopper 
Lead Pitch2285 
Minimum Lead Spacing1145 
Die Fabrication
Fabrication Process Identifier33468LLJ 
Package Assembly*
Plating Finish Layer Thickness8.0um - 13um 
Thermal Impedance (Theta JA)43°C/Watt
Thermal Impedance (Theta JC)1°C/Watt
Moisture Sensitivity1 
UL Flammability RatingUL94-V0 
Die Attach TypeSolder /92.5Pb 
DAP SizeRedesign 
Frame Material12SNOFC 

*If an attribute is listed twice, either can be used on the part.

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