| FDG8842CZ
Q1:30V/Q2: -25V Complementary PowerTrench® MOSFET |
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Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | &Y
.42 | |
| Family Code | 054 | |
| Package Type | SC70-6 | |
| Package Description | 006, PLASTIC MOLDED SC70-6 LEAD PACKAGE, SMD | |
| Pin Count | 6 | |
| FIT | 25.2 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance | ||
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Iron Nickel | |
| Lead Pitch | 650 | |
| Minimum Lead Spacing | 350 | |
| Die Fabrication | ||
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* | ||
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 350 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test | ||
| ESD Human Body Model (HBM) | 2100 | V |
| ESD Machine Model (MM) | 190 | V |
| Package Assembly* | ||
| UL Flammability Rating | UL94-V0 | |
| DAP Size | 30X17.5 MIL | |
| Frame Material | A42HH | |
*If an attribute is listed twice, either can be used on the part.