Fairchild Semiconductor
FDMF6700
Driver plus FET Multi-chip Module

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: 3
  • Thermal Impedance: 999/999
  • Physical Dimensions: Power 66
space



AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&2&T
FDMF6700 		 
Family Code05Q 
Package TypePower 66 
Package Description40LD, MLP, JEDEC MO-220, QUAD, 6MM SQUARE 
Pin Count40 
Die Fabrication
Fabrication Process IdentifierSEE SPEC REV 
Package Assembly*
Thermal Impedance (Theta JA)999°C/Watt
Thermal Impedance (Theta JC)999°C/Watt
Moisture Sensitivity3 
DAP Size40L 
Frame Material2.32X2/2.67X1.82/4.9X2.4 
Wire MaterialAu 
Wire Diameter2.0 MIL 
Wire MaterialAu 
Wire Diameter1.3 MIL 
Die Attach TypeEpoxy / EN-4620K 

*If an attribute is listed twice, either can be used on the part.

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