| FDMF8700
Driver plus FET Multi-chip Module |
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|
Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | $Y&Z&2&T
FDMF8700 | |
| Family Code | 05Q | |
| Package Type | Power 88 | |
| Package Description | 56LD, MLP, QUAD, JEDEC MO-220, VAR WLLD, 8X8MM, TRIPLE DAP | |
| Pin Count | 56 | |
| Die Fabrication | ||
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* | ||
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | 3 | |
| Electrical Test | ||
| ESD Human Body Model (HBM) | TBD | V |
| ESD Charged Device Model (CDM) | NA | V |
| ESD Machine Model (MM) | TBD | V |
| Package Assembly* | ||
| DAP Size | 56L.0.5P | |
| Frame Material | 3 Dap | |
| Die Attach Type | Epoxy / EN-4620K | |
| Wire Material | Au | |
| Wire Diameter | 2.0 MIL | |
| Wire Material | Au | |
| Wire Diameter | 1.3 MIL | |
*If an attribute is listed twice, either can be used on the part.