Fairchild Semiconductor
FDU8770
25V N-Channel PowerTrench MOSFET

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: NA
  • Thermal Impedance: 2/52
  • Physical Dimensions: TO-251(IPAK)
  • ESD HBM: 1200
  • ESD MM: 390
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AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&3&K
FDU
8770
 
Family Code054 
Package TypeTO-251(IPAK) 
Package Description003, PLASTIC MOLDED, TO-251 IPAK PKG, THRU-HOLE (39) 
Pin Count3 
FIT25.2 
MSL Rating| 
Restriction of Hazardous Substance
Standard Plating FinishMatte Sn 
Die Fabrication
Fabrication Process Identifier33250LFJ 
Package Assembly*
Plating Finish Layer Thickness8.0um - 13um 
Thermal Impedance (Theta JA)52°C/Watt
Thermal Impedance (Theta JC)2°C/Watt
Moisture SensitivityNA 
Electrical Test
ESD Human Body Model (HBM)1200V
ESD Machine Model (MM)390V

*If an attribute is listed twice, either can be used on the part.

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