Fairchild Semiconductor
FGA15N120FTDTU
1200V, 15A Field Stop Trench IGBT

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: NA
  • Thermal Impedance: 1/63
  • Physical Dimensions: TO-3PN
  • ESD HBM: 2500
space



AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&3&K
FGA15N120
FTD
 
Family Code0S4 
Package TypeTO-3PN 
Package DescriptionMOLDED PACKAGE, TT-3P,3LDS 
Pin Count3 
FIT133 
Die Fabrication
Fabrication Process IdentifierSEE SPEC REV 
Package Assembly*
Thermal Impedance (Theta JA)63°C/Watt
Thermal Impedance (Theta JC)1°C/Watt
Moisture SensitivityNA 
Electrical Test
ESD Human Body Model (HBM)2500V
Package Assembly*
UL Flammability RatingTO3P 
Wire MaterialAL 
Wire Diameter6.0 MIL 
Wire MaterialAL 
Wire Diameter15.0 MIL 

*If an attribute is listed twice, either can be used on the part.

© Copyright 2009 Fairchild Semiconductor