Fairchild Semiconductor
FGPF30N30
300V, 30A PDP IGBT

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: NA
  • Thermal Impedance: 3/62
  • Physical Dimensions: TO-220F
  • ESD HBM: 2000
  • ESD MM: 200
space



AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&3&K
FGPF
30N30
 
Family Code0S4 
Package TypeTO-220F 
Package Description003, PLASTIC MOLDED TO220-3 LDS, ISOLATED HEAT SINK 
Pin Count3 
FIT133 
Die Fabrication
Fabrication Process IdentifierSEE SPEC REV 
Package Assembly*
Thermal Impedance (Theta JA)62°C/Watt
Thermal Impedance (Theta JC)3°C/Watt
Moisture SensitivityNA 
Electrical Test
ESD Human Body Model (HBM)2000V
ESD Machine Model (MM)200V
Package Assembly*
DAP Size283*244 MILS 
Frame MaterialDUAI GAGE SINGLE STAND 
Wire MaterialAL 
Wire Diameter15.0 MIL 
Wire MaterialAL 
Wire Diameter6.0 MIL 

*If an attribute is listed twice, either can be used on the part.

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