Fairchild Semiconductor
FGPF50N30TTU
300V, 50A PDP IGBT

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: NA
  • Thermal Impedance: 3/63
  • Physical Dimensions: TO-220F
  • ESD HBM: 2500
space



AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&3&K
FGPF
50N30T
 
Family Code0S4 
Package TypeTO-220F 
Package Description003, PLASTIC MOLDED TO220-3 LDS, ISOLATED HEAT SINK 
Pin Count3 
FIT133 
Die Fabrication
Fabrication Process IdentifierSEE SPEC REV 
Package Assembly*
Thermal Impedance (Theta JA)63°C/Watt
Thermal Impedance (Theta JC)3°C/Watt
Moisture SensitivityNA 
Electrical Test
ESD Human Body Model (HBM)2500V
Package Assembly*
DAP Size283*244 MILS 
Frame MaterialDUAI GAGE SINGLE STAND 
Wire MaterialAL 
Wire Diameter15.0 MIL 
Wire MaterialAL 
Wire Diameter6.0 MIL 

*If an attribute is listed twice, either can be used on the part.

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