Fairchild Semiconductor
FGPF70N30TTU
300V, 70A PDP IGBT

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: NA
  • Thermal Impedance: 3/63
  • Physical Dimensions: TO-220F
space



AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&E&3
FGPF
70N30T
 
Family Code0S4 
Package TypeTO-220F 
Package Description003, PLASTIC MOLDED TO220-3 LDS, ISOLATED HEAT SINK 
Pin Count3 
FIT133 
Maximum Reflow TemperatureNA (thru hole) 
MSL RatingNA (thru hole)| 
Restriction of Hazardous Substance
Standard Plating FinishMatte Sn 
Base Metal/Leadframe MaterialCopper,Iron,Phosphorus,Silver 
Die Fabrication
Fabrication Process IdentifierSEE SPEC REV 
Package Assembly*
Plating Finish Layer Thickness8.0um - 25um 
Thermal Impedance (Theta JA)63°C/Watt
Thermal Impedance (Theta JC)3°C/Watt
Moisture SensitivityNA 
DAP Size283*244 MILS 
Frame MaterialDUAI GAGE SINGLE STAND 
Wire MaterialAL 
Wire Diameter6.0 MIL 
Wire MaterialAL 
Wire Diameter15.0 MIL 

*If an attribute is listed twice, either can be used on the part.

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