| FIN12ACMLX
***Please use FIN212AC for new designs. |
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|
Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Die Revision Level | Z | |
| Device Marking(TOP MARK) | $Y&Z&2&K
FIN12AC | |
| Family Code | 0RF | |
| Package Type | MLP | |
| Package Description | 32LD,MLP,JEDEC MO-220,QUAD,5MM SQUARE | |
| Pin Count | 32 | |
| Die Size X | 2000 | MC |
| Die Size Y | 4000 | MC |
| Die Fabrication | ||
| Fabrication Process Identifier | RF6FS35C3LM | |
| Package Assembly* | ||
| Moisture Sensitivity | 3 | |
| Electrical Test | ||
| ESD Human Body Model (HBM) | 3500 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| ESD Machine Model (MM) | 150 | V |
| Package Assembly* | ||
| DAP Size | 32L | |
| Frame Material | 3.694Sq MM | |
| Die Attach Type | Epoxy / EN-4620K | |
| Wire Material | Au | |
| Wire Diameter | 1.0 MIL | |
*If an attribute is listed twice, either can be used on the part.