| FIN3383MTDX
Low Voltage 28-Bit Flat Panel Display Link Serializers |
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Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | $Y&Z&2&K
FIN3383 | |
| Family Code | 0M8 | |
| Package Type | TSSOP | |
| Package Description | 056,PLASTIC, TSSOP 6.1MM W, .50MM PH, JEDEC | |
| Pin Count | 56 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 2| | |
| Restriction of Hazardous Substance | ||
| Standard Plating Finish | NiPdAu (Penang); Matte Sn (ATP) | |
| Base Metal/Leadframe Material | Copper,Nickel,Magnesium,Silicon,Silver | |
| Lead Pitch | 500 | |
| Minimum Lead Spacing | 230 | |
| Die Fabrication | ||
| Fabrication Process Identifier | M88TSMCLVD | |
| Package Assembly* | ||
| Plating Finish Layer Thickness | 0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au; 8.0um - 13um Matte Sn | |
| Thermal Impedance (Theta JA) | 74 | °C/Watt |
| Thermal Impedance (Theta JC) | 29 | °C/Watt |
| Moisture Sensitivity | 2 | |
| Electrical Test | ||
| ESD Human Body Model (HBM) | 6500 | V |
| ESD Charged Device Model (CDM) | 400 | V |
| ESD Machine Model (MM) | 1000 | V |
| Package Assembly* | ||
| Wire Material | Au | |
| Wire Diameter | 1.0 MIL | |
| Die Attach Type | Epoxy / QMI 519 | |
| DAP Size | 3.5X5.0MM | |
| Frame Material | Cu | |
*If an attribute is listed twice, either can be used on the part.