Fairchild Semiconductor
FPDB30PH60
Smart Power Module for Front-End Rectifier

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: NA
  • Thermal Impedance: 1/2
  • Physical Dimensions: SPM27-GA
  • ESD HBM: 2000
  • ESD MM: 200
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AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y
FPDB30PH60
&H&E&E&E&E&3
AS&H&3
 
Family Code0SC 
Package TypeSPM27-GA 
Package DescriptionSPM27-GA, F-PFCM 
Pin Count27 
FIT11.2 
Die Fabrication
Fabrication Process IdentifierSEE SPEC REV 
Package Assembly*
Thermal Impedance (Theta JA)2°C/Watt
Thermal Impedance (Theta JC)1°C/Watt
Moisture SensitivityNA 
Electrical Test
ESD Human Body Model (HBM)2000V
ESD Machine Model (MM)200V
Package Assembly*
Wire MaterialAU 
Wire Diameter1.3 MIL 
Wire MaterialAL 
Wire Diameter20.0 MIL 
Wire MaterialAL 
Wire Diameter6.0 MIL 

*If an attribute is listed twice, either can be used on the part.

© Copyright 2008 Fairchild Semiconductor