| FPF1009
FPF1009 - IntelliMAX™ Advanced Load Products |
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|
Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | &E&Y
&O009&C &.&O&V | |
| Family Code | 05E | |
| Package Type | MLP | |
| Package Description | 6LD,MLP,DUAL,JEDEC MO-229,2MM SQUARE | |
| Pin Count | 6 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance | ||
| Standard Plating Finish | NiPdAu | |
| Die Fabrication | ||
| Fabrication Process Identifier | 5E8FS35C52BD | |
| Package Assembly* | ||
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test | ||
| ESD Human Body Model (HBM) | 8000 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| Package Assembly* | ||
| DAP Size | 6L | |
| Frame Material | 1.600X1.000MM | |
| Die Attach Type | Epoxy / QMI 519 | |
| Wire Material | Au | |
| Wire Diameter | 1.5 MIL | |
*If an attribute is listed twice, either can be used on the part.