| FQP11N40C
400V N-Channel Advanced QFET C-series |
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Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | $Y&Z&E&3
FQP 11N40C | |
| Family Code | 0SQ | |
| Package Type | TO-220 | |
| Package Description | 3 LD PLASTIC W/EXPOSED HEATSNK | |
| Pin Count | 3 | |
| FIT | 12.9 | |
| Maximum Reflow Temperature | NA (thru hole) | |
| MSL Rating | NA (thru hole)| | |
| Restriction of Hazardous Substance | ||
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Phosphorus,Silver | |
| Die Fabrication | ||
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* | ||
| Plating Finish Layer Thickness | 8.0um - 25um | |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | NA | |
| Wire Material | AL | |
| Wire Diameter | 10.0 MIL | |
| Wire Material | AL | |
| Wire Diameter | 6.0 MIL | |
*If an attribute is listed twice, either can be used on the part.