| FQPF13N50C
500V N-Channel Advance Q-FET C-Series |
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|
Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | $Y&Z&E&3
FQPF 13N50C | |
| Family Code | 0SQ | |
| Package Type | TO-220F | |
| Package Description | 003, PLASTIC MOLDED TO220-3 LDS, ISOLATED HEAT SINK | |
| Pin Count | 3 | |
| FIT | 12.9 | |
| Die Fabrication | ||
| Fabrication Process Identifier | EC1350X | |
| Package Assembly* | ||
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | NA | |
| Wire Material | AL | |
| Wire Diameter | 6.0 MIL | |
| Wire Material | AL | |
| Wire Diameter | 12.0 MIL | |
| DAP Size | 283*244 MILS | |
| Frame Material | DUAI GAGE SINGLE STAND | |
*If an attribute is listed twice, either can be used on the part.