Low Voltage, 1 Ohm, Dual SPST Analog Switch with Power-Off Isolation
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Qualification Data
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| General Information | | Device Marking(TOP MARK) | &2&K
1259
$Y&Z
| | | Family Code | 063 | | | Package Type | US8 | | | Package Description | 8 LD, MOLDED, VSOP, .7MMX3.1MMX2.0MM | | | Pin Count | 8 | | | FIT | 35.3 | | | Maximum Reflow Temperature | 260C | | | MSL Rating | 1| | | | Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | | Base Metal/Leadframe Material | Copper,Nickel,Silicon,Magnesium,Zinc | | | Lead Pitch | 500 | | | Minimum Lead Spacing | 230 | | | Die Fabrication | | Fabrication Process Identifier | 63650BCFLBD | | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 9000 | V | | ESD Charged Device Model (CDM) | 2000 | V | | ESD Machine Model (MM) | 400 | V |
*If an attribute is listed twice, either can be used on the part.
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