| FSA221L10X
USB 2.0 Hi-Speed and Audio Switches w/ Negative Signal Capability |
|||
|
Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | GK | |
| Family Code | 0GF | |
| Package Type | MicroPak | |
| Package Description | MICROPAK,1.60MM X 2.10MM,10 LEADS | |
| Pin Count | 10 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance | ||
| Standard Plating Finish | NiAu | |
| Die Fabrication | ||
| Fabrication Process Identifier | 63650BCFLBD | |
| Package Assembly* | ||
| Plating Finish Layer Thickness | 0.5um - 1.5um Au | |
| Moisture Sensitivity | 1 | |
| Electrical Test | ||
| ESD Human Body Model (HBM) | 7000 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
*If an attribute is listed twice, either can be used on the part.