| FSA2380BQX
Low Ron (0.75 Ohm) 3:1 Negative Swing Audio Source Switch |
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Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | $Y&Z&2&K
2380 | |
| Family Code | 0GF | |
| Package Type | DQFN | |
| Package Description | 14LD,DQFN,JEDEC MO-241,2.5X3.0 MM | |
| Pin Count | 14 | |
| MSL Rating | | | |
| Restriction of Hazardous Substance | ||
| Standard Plating Finish | Sn | |
| Die Fabrication | ||
| Fabrication Process Identifier | GF650BCFLBD | |
| Package Assembly* | ||
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Moisture Sensitivity | 1 | |
| Electrical Test | ||
| ESD Human Body Model (HBM) | 5500 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| Package Assembly* | ||
| DAP Size | 3X2.5 MM | |
| Wire Material | Au | |
| Wire Diameter | 1.0 MIL | |
| Die Attach Type | Epoxy / EN-4620K | |
*If an attribute is listed twice, either can be used on the part.