| FSA6157L6X_F113
Low RON SPDT Negative-Swing Audio or Video Switch |
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Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | GT | |
| Family Code | 063 | |
| Package Type | MicroPak | |
| Package Description | 6LD, MICROPAK MLP, 1.0MM X 1.45MM (PREMOLDED) | |
| Pin Count | 6 | |
| FIT | 35.3 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance | ||
| Standard Plating Finish | NiAu | |
| Base Metal/Leadframe Material | BT Substrate with NiPdAu | |
| Lead Pitch | 650 | |
| Minimum Lead Spacing | 350 | |
| Die Fabrication | ||
| Fabrication Process Identifier | 636FS35C32BD | |
| Package Assembly* | ||
| Plating Finish Layer Thickness | 0.5um - 1.5um Au | |
| Moisture Sensitivity | 1 | |
| Electrical Test | ||
| ESD Human Body Model (HBM) | 8000 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| Package Assembly* | ||
| Wire Material | Au | |
| Wire Diameter | 0.8 MIL | |
| DAP Size | 6L | |
| Frame Material | 1.45X1.0MM | |
*If an attribute is listed twice, either can be used on the part.