Fairchild Semiconductor
FSAM20SH60A
20A, Smart Power Module (SPM)

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: NA
  • Thermal Impedance: 3/2
  • Physical Dimensions: SPM32-AA P
  • ESD HBM: 2000
  • ESD MM: 200
space



AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y
FSAM20SH60A
&H&E&E&E&E&E&3
 
Family Code0SC 
Package TypeSPM32-AA P 
Package DescriptionSPM32-AA PACKAGE 
Pin Count32 
FIT11.2 
Die Fabrication
Fabrication Process IdentifierSEE SPEC REV 
Package Assembly*
Thermal Impedance (Theta JA)2°C/Watt
Thermal Impedance (Theta JC)3°C/Watt
Moisture SensitivityNA 
Electrical Test
ESD Human Body Model (HBM)2000V
ESD Machine Model (MM)200V
Package Assembly*
Wire MaterialAL 
Wire Diameter8.0 MIL 
DAP SizeSPM 
Wire MaterialAU 
Wire Diameter1.3 MIL 
Wire MaterialAL 
Wire Diameter12.0 MIL 

*If an attribute is listed twice, either can be used on the part.

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