Fairchild Semiconductor
FSBB15CH60F
Smart Power Module

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: NA
  • Thermal Impedance: 4/2
  • Physical Dimensions: SPM27-CA
space



AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y
FSBB15CH60F
&H&E&E&E&E&E&3
AY&H&3
 
Family Code0SC 
Package TypeSPM27-CA 
Package DescriptionPDD_STD_MINI DUAL IN-LINE PACKAGE OF SPM27-CA, SPM3V 
Pin Count27 
FIT11.2 
Die Fabrication
Fabrication Process IdentifierSEE SPEC REV 
Package Assembly*
Thermal Impedance (Theta JA)2°C/Watt
Thermal Impedance (Theta JC)4°C/Watt
Moisture SensitivityNA 
Wire MaterialAL 
Wire Diameter8.0 MIL 
UL Flammability RatingSPM 
Wire MaterialAU 
Wire Diameter1.3 MIL 

*If an attribute is listed twice, either can be used on the part.

© Copyright 2009 Fairchild Semiconductor