Fairchild Semiconductor
FSBB20CH60BT
Smart Power Module

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: NA
  • Thermal Impedance: 3/3
  • Physical Dimensions: SPM27-CC
space



AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y
FSBB20CH60BT
&H&E&E&E&E&E&3
CU&H&3
 
Family Code0SC 
Package TypeSPM27-CC 
Package DescriptionPDD STD, SPM27-CC (AL2O3 DBC, VS LONG INNER BOND), SPM3-V4 
Pin Count27 
FIT11.2 
Die Fabrication
Fabrication Process IdentifierSEE SPEC REV 
Package Assembly*
Thermal Impedance (Theta JA)3°C/Watt
Thermal Impedance (Theta JC)3°C/Watt
Moisture SensitivityNA 
Wire MaterialAL 
Wire Diameter8.0 MIL 
Wire MaterialAU 
Wire Diameter1.3 MIL 

*If an attribute is listed twice, either can be used on the part.

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