| FSQ311
SMPS Power Switch(QRC), 0.5A, 650V, 8DIP/8LSOP (Green) |
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Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | Q311
&E&E&Z&3 | |
| Family Code | 0SG | |
| Package Type | DIP | |
| Package Description | 008,PLASTIC, MOLDED DIP | |
| Pin Count | 8 | |
| Die Size X | 2700 | MLL |
| Die Size Y | 3140 | MLL |
| FIT | 3 | |
| Maximum Reflow Temperature | NA (thru hole) | |
| MSL Rating | NA (thru hole)| | |
| Restriction of Hazardous Substance | ||
| Standard Plating Finish | Matte Sn | |
| Die Fabrication | ||
| Fabrication Process Identifier | AR3752X | |
| Package Assembly* | ||
| Plating Finish Layer Thickness | 8.0um - 18um | |
| Thermal Impedance (Theta JA) | 89 | °C/Watt |
| Thermal Impedance (Theta JC) | 14 | °C/Watt |
| Moisture Sensitivity | NA | |
| Electrical Test | ||
| ESD Human Body Model (HBM) | 1500 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| ESD Machine Model (MM) | 200 | V |
*If an attribute is listed twice, either can be used on the part.