Fairchild Semiconductor
FSUSB11L10X
Low Power Full Speed USB Switch

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: 1
  • Physical Dimensions: MicroPak
  • ESD HBM: 8000
  • ESD CDM: 2000
  • ESD MM: 400
space



AttributeValueUOM
General Information
Device Marking(TOP MARK)ET  
Family Code063 
Package TypeMicroPak 
Package DescriptionMICROPAK,1.60MM X 2.10MM,10 LEADS 
Pin Count10 
FIT35.3 
Maximum Reflow Temperature260C 
MSL Rating1| 
Restriction of Hazardous Substance
Standard Plating FinishNiAu 
Package Assembly*
Plating Finish Layer Thickness0.5um - 1.5um Au 
Moisture Sensitivity1 
Electrical Test
ESD Human Body Model (HBM)8000V
ESD Charged Device Model (CDM)2000V
ESD Machine Model (MM)400V

*If an attribute is listed twice, either can be used on the part.

© Copyright 2008 Fairchild Semiconductor