| FSUSB23BQX
Low Power Hi-Speed USB 2.0 (480 Mbps) Switch |
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Qualification Data
|  |
| Attribute | Value |
|---|---|
| General Information | |
| Device Marking(TOP MARK) | $Y&Z&2&K
USB23 |
| Family Code | 063 |
| Package Type | DQFN |
| Package Description | 16LD,DQFN,JEDEC MO-241,2.5X3.5 MM |
| Pin Count | 16 |
| FIT | 35.3 |
| MSL Rating | | |
| Restriction of Hazardous Substance | |
| Standard Plating Finish | Sn |
| Die Fabrication | |
| Fabrication Process Identifier | TBD |
| Package Assembly* | |
| Plating Finish Layer Thickness | 8.0um - 13um |
| Moisture Sensitivity | 1 |
| DAP Size | 3.5X2.5 |
| Frame Material | 0.5P |
| Die Attach Type | Epoxy / EN-4620K |
| Wire Material | Au |
| Wire Diameter | 1.0 MIL |
*If an attribute is listed twice, either can be used on the part.