| FSUSB23L10X
Low Power Hi-Speed USB 2.0 (480 Mbps) Switch |
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Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | EZ | |
| Family Code | 063 | |
| Package Type | MicroPak | |
| Package Description | MICROPAK,1.60MM X 2.10MM,10 LEADS | |
| Pin Count | 10 | |
| FIT | 35.3 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance | ||
| Standard Plating Finish | NiAu | |
| Die Fabrication | ||
| Fabrication Process Identifier | 636FS50BC5S | |
| Package Assembly* | ||
| Plating Finish Layer Thickness | 0.5um - 1.5um Au | |
| Moisture Sensitivity | 1 | |
| Electrical Test | ||
| ESD Human Body Model (HBM) | 7000 | V |
| ESD Charged Device Model (CDM) | 1000 | V |
| ESD Machine Model (MM) | 350 | V |
*If an attribute is listed twice, either can be used on the part.