Fairchild Semiconductor
FSUSB30L10X
Low Power 2-Port Hi-Speed USB 2.0 (480 Mbps) Switch

Qualification Data

Fairchild Product Reliability Report

     Contact your regional quality and reliability representative with any questions on product qualification support.

    Test Standards:

  • Moisture Sensitivity: 1
  • Physical Dimensions: MicroPak
  • ESD HBM: 8000
  • ESD CDM: 2000
  • ESD MM: 200
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AttributeValueUOM
General Information
Device Marking(TOP MARK)FJ  
Family Code063 
Package TypeMicroPak 
Package DescriptionMICROPAK,1.60MM X 2.10MM,10 LEADS 
Pin Count10 
FIT35.3 
Maximum Reflow Temperature260C 
MSL Rating1| 
Restriction of Hazardous Substance
Standard Plating FinishNiAu 
Die Fabrication
Fabrication Process Identifier636FS35C32BD 
Package Assembly*
Plating Finish Layer Thickness0.5um - 1.5um Au 
Moisture Sensitivity1 
Electrical Test
ESD Human Body Model (HBM)8000V
ESD Charged Device Model (CDM)2000V
ESD Machine Model (MM)200V

*If an attribute is listed twice, either can be used on the part.

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