| FXLH1T45L6X
Low Voltage 1-Bit Bi-directional Level Translator with Configurable Voltage Supplies and Bushold Data Inputs (Advance Information) |
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Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | XD | |
| Family Code | 071 | |
| Package Type | MicroPak | |
| Package Description | MICROPAK,1.00MM X 1.45MM,6 LEADS | |
| Pin Count | 6 | |
| FIT | 5.9 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance | ||
| Standard Plating Finish | NiAu | |
| Base Metal/Leadframe Material | BT Substrate with NiPdAu | |
| Lead Pitch | 650 | |
| Minimum Lead Spacing | 350 | |
| Die Fabrication | ||
| Fabrication Process Identifier | 716FS35C | |
| Package Assembly* | ||
| Plating Finish Layer Thickness | 0.5um - 1.5um Au | |
| Moisture Sensitivity | 1 | |
| Electrical Test | ||
| ESD Human Body Model (HBM) | 4KV | V |
| ESD Charged Device Model (CDM) | 2KV | V |
| ESD Machine Model (MM) | NA | V |
*If an attribute is listed twice, either can be used on the part.