| HGTG20N60B3
600V, UFS Series N-Channel IGBT |
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Qualification Data
|  |
| Attribute | Value | UOM |
|---|---|---|
| General Information | ||
| Device Marking(TOP MARK) | $Y&Z&3&K
HG20N60B3 | |
| Family Code | 024 | |
| Package Type | TO-247 | |
| Package Description | ADDED FOR DPP(INTERSIL) PKG ID CHANGE | |
| Pin Count | 3 | |
| FIT | 13.2 | |
| Maximum Reflow Temperature | NA (thru hole) | |
| MSL Rating | NA (thru hole)| | |
| Restriction of Hazardous Substance | ||
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Nickel | |
| Lead Pitch | 5450 | |
| Minimum Lead Spacing | 4100 | |
| Die Fabrication | ||
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* | ||
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | NA | |
*If an attribute is listed twice, either can be used on the part.