Fairchild Semiconductor
MM74HC574N
3-STATE Octal D-Type Edge-Triggered Flip-Flop

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: NA
  • Physical Dimensions: DIP
space



AttributeValue
General Information
Device Marking(TOP MARK)$Y&Z&4&K&P
MM74HC574N
MC74HC574N
Family Code041
Package TypeDIP
Package Description020,PLASTIC, MOLDED DIP
Pin Count20
FIT2.9
Maximum Reflow TemperatureNA (thru hole)
MSL RatingNA (thru hole)|
Restriction of Hazardous Substance
Standard Plating FinishMatte Sn
Base Metal/Leadframe MaterialCopper,Iron,Phosphorus,Zinc,Silver
Lead Pitch2540
Minimum Lead Spacing760
Package Assembly*
Plating Finish Layer Thickness8.0um - 13um
Moisture SensitivityNA
DAP Size90X110 MIL
Frame MaterialCu
Wire MaterialAu
Wire Diameter1.0 MIL
Die Attach TypeEpoxy / Poly 6
UL Flammability RatingUL94-V0

*If an attribute is listed twice, either can be used on the part.

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