Fairchild Semiconductor
MM74HC574SJX
3-STATE Octal D-Type Edge-Triggered Flip-Flop

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: 1
  • Physical Dimensions: SOP
space



AttributeValue
General Information
Device Marking(TOP MARK)$Y&Z&2&K
HC574SJ
Family Code041
Package TypeSOP
Package Description020,PLAS,MOLDED EIAJ SO
Pin Count20
FIT2.9
Maximum Reflow Temperature260C
MSL Rating1|
Restriction of Hazardous Substance
Standard Plating FinishMatte Sn
Die Fabrication
Fabrication Process IdentifierTBD
Package Assembly*
Plating Finish Layer Thickness8.0um - 13um
Moisture Sensitivity1
UL Flammability RatingUL94-V0
Wire MaterialAu
Wire Diameter0.9 MIL
Die Attach TypeEpoxy / Poly 6
DAP Size110X130 MIL
Frame MaterialCu

*If an attribute is listed twice, either can be used on the part.

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