TinyLogic UHS Inverter
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Qualification Data
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| General Information | | Device Marking(TOP MARK) | &2&K
NZ04
$Y&Z
| | Family Code | 03P | | Package Type | US8 | | Package Description | 8 LD, MOLDED, VSOP, .7MMX3.1MMX2.0MM | | Pin Count | 8 | | FIT | 2.9 | | Maximum Reflow Temperature | 260C | | MSL Rating | 1| | | Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | Base Metal/Leadframe Material | Copper,Nickel,Silicon,Magnesium,Zinc | | Lead Pitch | 500 | | Minimum Lead Spacing | 230 | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | Moisture Sensitivity | 1 |
*If an attribute is listed twice, either can be used on the part.
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