Fairchild Semiconductor
NC7S00L6X
TinyLogic HS 2-Input NAND Gate

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: 1
  • Physical Dimensions: MicroPak
  • ESD HBM: 0
space



AttributeValue
General Information
Die Revision LevelY
Device Marking(TOP MARK)A3
Family Code06Y
Package TypeMicroPak
Package DescriptionMICROPAK,1.00MM X 1.45MM,6 LEADS
Pin Count6
FIT2
Maximum Reflow Temperature260C
MSL Rating1|
Restriction of Hazardous Substance
Standard Plating FinishNiAu
Base Metal/Leadframe MaterialBT Substrate with NiPdAu
Lead Pitch650
Minimum Lead Spacing350
Die Fabrication
Fabrication Process Identifier3P6C5LBPOAPD
Package Assembly*
Plating Finish Layer Thickness0.5um - 1.5um Au
Moisture Sensitivity1

*If an attribute is listed twice, either can be used on the part.

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