| General Information |
| Die Revision Level | Y |
| Device Marking(TOP MARK) | A3
|
| Family Code | 06Y |
| Package Type | MicroPak |
| Package Description | MICROPAK,1.00MM X 1.45MM,6 LEADS |
| Pin Count | 6 |
| FIT | 2 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiAu |
| Base Metal/Leadframe Material | BT Substrate with NiPdAu |
| Lead Pitch | 650 |
| Minimum Lead Spacing | 350 |
| Die Fabrication |
| Fabrication Process Identifier | 3P6C5LBPOAPD |
| Package Assembly* |
| Plating Finish Layer Thickness | 0.5um - 1.5um Au |
| Moisture Sensitivity | 1 |