Fairchild Semiconductor
NC7WZ04L6X
TinyLogic UHS Dual Inverter

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: 1
  • Physical Dimensions: MicroPak
  • ESD CDM: 2000
space



AttributeValueUOM
General Information
Device Marking(TOP MARK)A7  
Family Code03P 
Package TypeMicroPak 
Package DescriptionMICROPAK,1.00MM X 1.45MM,6 LEADS 
Pin Count6 
FIT2.9 
Maximum Reflow Temperature260C 
MSL Rating1| 
Restriction of Hazardous Substance
Standard Plating FinishNiPdAu 
Base Metal/Leadframe MaterialCu with NiPdAu 
Lead Pitch650 
Minimum Lead Spacing350 
Die Fabrication
Fabrication Process Identifier3P6C5LBPOAD 
Package Assembly*
Plating Finish Layer Thickness0.5um - 1.5um Au 
Moisture Sensitivity1 
Electrical Test
ESD Charged Device Model (CDM)2000V

*If an attribute is listed twice, either can be used on the part.

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