Fairchild Semiconductor's Motion-SPM™ Power Modules Maximize Space, Efficiency and Reliability in Home Appliances and Industrial Motors Up to 3kW

San Jose, California – September 4, 2007 – Fairchild Semiconductor (NYSE:FCS) introduces ten new highly efficient, integrated Motion-SPM power modules for home appliances and industrial motors up to 3kW. Integrating fully tested three HVICs, one LVIC, six NPT IGBTs, six FRDs and three bootstrap diodes into a compact 44mm X 26.8mm Mini-DIP package, these Motion-SPM modules offer superior inverter-based control for energy-efficient 3-phase motors. Replacing as many as 22 discrete components, these products are instrumental in reducing board space, decreasing manufacturing costs and speeding time-to-market, and increasing system reliability.

“Fairchild continues to innovate its product offering by providing leading SPM® power modules solutions. We have integrated three bootstrap diodes with bootstrap resistor characteristics into currently available SPM modules to make a simpler and smaller board design possible, eliminating an additional six external components. These modules feature NPT IGBTs that provide optimal trade-offs between conduction losses and switching losses and high guaranteed junction temperature to improve system efficiency and reliability.” said Taehoon Kim, vice president of Fairchild’s Functional Power Solutions. “Fairchild’s Motion-SPM power modules are ideal solutions for energy and cost-restricted motor applications.”

Key benefits of the Motion-SPM power modules include:

• Space and cost savings
  • Motion-SPM modules in 44mm X 26.8mm Mini-DIP packaging replace 22 discrete components.
  • Built-in HVIC provides a single-grounded power supply for an optocoupler-less interface

• System efficiency
  • Built-in NPT IGBTs provide optimal tradeoffs between conduction losses and switching losses (FSBB15CH60B (600V/15A): V_CE(SAT), typ = 1.6V, E _OFF, typ = 28µJ/A)
  • Short dead time (FSBB15CH60B: t_dead = 1.5µs); and

• System reliability
  • Integration of 19 fully tested components
  • High guaranteed junction temperature (T_J =150°C) and isolation voltage of 2500V
  • Long short-circuit withstand time
  • Under-voltage (UV), thermal shutdown (TSD), and short-circuit (SC) protection

These highly integrated devices are packaged in full molded or Direct Bonded Copper (DBC) based Mini-DIP packages. This innovative DBC based Mini-DIP package provides extremely low thermal resistance (FSBB30CH60B (600V/30A): R _th(j-c), IGBT = 1.17°C/W).

These Motion-SPM products utilize lead-free (Pb-free) terminals and have been characterized for moisture sensitivity in accordance with the Pb-free reflow requirements of the joint IPC/JEDEC standard J-STD-020. All of Fairchild's products are designed to meet the requirements of the European Union's Directive on the restriction of the use of certain substances (RoHS).

Product	BVCES (min.)[V]	IC(TC =25ºC)[A]	Motor Rating		Package	Price(each) US$ 100 pcs
			Watt[kW]	VAC[V]
FSBF3CH60B	600	3	0.3	100~253	Full molded Mini-DIP	11.8
FSBF5CH60B	600	5	0.5			12.8
FSBF10CH60BT	600	10	0.8			13.6
FSBF10CH60B	600	10	1.0			14.0
FSBF15CH60BT	600	15	1.1			14.8
FSBB15CH60BT	600	15	1.5		DBC based Mini-DIP	17.0
FSBB15CH60B	600	15	1.7			17.8
FSBB20CH60BT	600	20	2.2			18.4
FSBB20CH60B	600	20	2.4			19.6
FSBB30CH60B	600	30	3.0			28.4

Price: (See table above)

Availability: samples available now

Delivery: 12 weeks ARO

Contact Information: To contact Fairchild Semiconductor about this product, please go to: www.fairchildsemi.com/cf/sales_contacts/.

For information on other products, design tools and sales contacts, please visit: www.fairchildsemi.com.

To learn more contact:

Fairchild Semiconductor:
Fairchild Semiconductor, Korea:
Eunjin Park, Market Development Program Manager
82-3, Dodang-dong, Wonmi-gu
Bucheon, Gyeonggi-do, Korea
82-32-680-1961| Fax: 82-32-680-1823
Email: Eunjin.park@fairchildsemi.com

Agency Contact
Marsha Lisak
Senior Account Executive
WelComm, Inc.
7975 Raytheon Rd. Ste 340
San Diego, CA 92111

About Fairchild Semiconductor:
Fairchild Semiconductor (NYSE: FCS) is the global leader in power analog and power discrete technologies delivering energy-efficient solutions for all electronic systems. Recognized as The Power Franchise®, Fairchild provides leading-edge silicon and packaging technologies, manufacturing strength and system expertise. In 2007, Fairchild celebrates its “50/10” anniversary, commemorating 10 years as a new company and 50 years in the industry. Known as the “Father of Silicon Valley,” Fairchild developed the planar transistor in 1958––and with it a new industry. Today, Fairchild is an application-driven, solution-based semiconductor supplier providing online design tools and design centers worldwide as part of its comprehensive Global Power Resource^SM . Please contact us on the web at www.fairchildsemi.com.