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The Motion-SPM™ in Mini-DIP series consists of a suite of
seventeen IGBT inverter modules and two MOSFET modules offering
excellent thermal resistance. Each module integrate three high
voltage ICs (HVICs), one low voltage IC (LVIC) and six IGBTs with
fast recovery diodes or MOSFETs in the compact Mini-DIP (44 mm
X 26.8 mm) package. Designers can achieve increased design flexibility
for the entire power range from 0.15kW to 3kW, as these devices
range from 3A to 30 A in a single package outline. This Motion-SPM™ series
could be reached to the targeted power rating of 30A in ultra-compact
packaging through Fairchild’s Direct
Bonded Copper (DBC) technology (FSBB series).
Product Offering
*three bootstrap diodes integrated
Features
• 3A to 30A rating in one package (with identical mechanical layouts)
• 600V/3A to 30A rating in one package (with identical mechanical
layouts)
• Low-loss efficient IGBTs and FRDs optimized for motor drive
applications
• 3-phase IGBT inverter bridge including control ICs for gate
driving and protection
- High-side: Control circuit under
voltage (UV) protection (without fault signal output)
- Low-side: UV and short-circuit (SC)
protection through external shunt resistor (with fault signal output)
• Single-grounded power supply and opto-coupler-less interface
due to built-in HVIC
• High-active input signal logic
• Divided negative DC-link terminals for inverter current sensing
applications
• Isolation voltage rating of 2500Vrms/min
• Very low leakage current due to ceramic and DBC
substrate.
• Package designed to satisfy the basic creepage and clearance
spacing – UL certified No. E209204
Application
Circuit Example
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