(From): StatsChipPAC (Kuala Lumpur, Malaysia) (To): Fairchild Semiconductor (Suzhou, China) Note 1: For products HGT1S7N60A4DS9A_R4921 and FFB20UP20DN_SB82117 the rectifier die diameter will change from 4" to 5"; Note 2: The molding compound for products HGT1S7N60A4DS9A_R4921 and FFB20UP20DN_SB82117 will be KTMC5900, the molding compound for all other products will be EME6600CS.

 (From): StatsChipPAC (Kuala Lumpur, Malaysia) (To): Fairchild Semiconductor (Suzhou, China)

(From): LMV324 and LMV358 in SOIC is currently Assembled and Tested at subcon Carsem, Ipoh/Malaysia (To): To qualify LMV324 and LMV358 SOIC Assembly and Test at
Fairchild's Facility in Penang, Malaysia.

 (From): The original location of JCET SOT223 assembly line: No 275, Binjiang Rd. M, Jiangyin, Jiangsu, P.R.C (To): The new location of JCET SOT223 assembly line: No 78
Changshan Rd. Jiangyin, Jiangsu, P.R.C. There is no difference in package dimension, process
and material between these sites

From): Paper box packing for GBPC parts (To): Plastic tray + box + shrinkage film to pack the GBPC parts.

(From): FPG MLP 2x2 Assembly at FSC Penang only (To): FPG MLP 2x2 Assembly at FSC Penang & subcon, Carsem.

(From): Existing epoxy and dye (Hysol) (To): Fairchild is adding Eclat, Epifine and Richtech as epoxy and dye material suppliers. All of the epoxy and dye materials are qualified to be used interchangeably. There is no difference in the form, fit, function or manufacturability of the devices when either the Hysol material or the alternate materials are used for assembly

(From): Use of special flowcode for Cu devices. (To): Remove flowcode used for Cu devices and convert the standard part to Cu wire.

(From): Wirebond material using 2mil Gold (Au) wire for SO8 devices manufactured in subcontractor site, GEM Electronics Ltd Shanghai China. (To): Wirebond material using 2mil Copper (Cu) wire for SO8 devices manufactured in subcontractor site, GEM Electronics Ltd Shanghai China.

 (From): AHG (To): Fairchild Suzhou in China is being added as an alternative
assembly/test location

(From): AUK in Korea AHG in China (To): AUK Dalian in China will be qualified as an alternatate assembly site for TO92 package. In addition to current suppliers,It is also TS16949 and ISO14001certified.

 (From): There are some items which will be corrected from gFS: 15S(Typ)// td(on): 7.2ns(Typ), 25(max)// tr: 68ns(typ), 146ns(max)// td(off): 77ns(typ), 164ns(max)// tf: 93ns(typ), 196ns(max)// trr: 62ns(typ)// Qrr: 150nC(typ) (To): to gFS: 32S(Typ)// td(on): 39ns(Typ), 88(max)// tr: 181ns(typ), 372ns(max)// td(off): 183ns(typ), 376ns(max)// tf: 82ns(typ), 173ns(max)// trr: 80ns(typ)// Qrr:193nC(typ)

(From): There are no passivation layer. (To): Adding Passivation layer on front metal.

 (From): 1. Shutdown Current decay time ~ 30 sec 2. Power Good logic is high when En goes low 3. Third line marking has "C" (To): 1. Shut down current decay time ~ 1 msec 2. Power Good logic is low when En is low 3. Third line marking has "C1"

 (From): Die change. (To): Four changes were made to the current production die with metal
mask updates. Change 1: The receiver serial clock signal was delayed to better center on the
serial data. Change 2: Internal serial interconnects were re-routed for better isolation from
transient signals. Change 3: The serial standby burst source current, IODSTBY, was increased
to improve noise immunity. The serial burst source current was increased from 130uA to 200uA typical. Change 4: ESD robustness was improved by adding a filter to ignore ESD transientevents on the serial lines.

 (From): ENOCH, SP, STS in Korea, SHEDCL in China.(To): ENOCH, SP in Korea, SHEDCL and PSTS in China.

 (From): Current Plating Coverage: Full NiPdAu Plating. Current Die attach Material: Tin-Antimony (Sn8.5Sb). (To): Proposed Plating Coverage: Selective NiPdAu plating on the
leadposts and exposed pad areas. The rest of the areas will be bare Copper. Proposed Die attach Material: High-Lead (92.5Pb5Sn2.5Ag).

(From): TO-3PN Package :L/F plating change : from Bare Cu L/F + With pre-bake process (To): to Ni plated L/F + Without pre-bake process

(From): aimhigh global corp. in Korea. (To): SP Semiconductor & Communication Co., Ltd. in Korea.

 (From): Au wire bonding in SPM3/3V package  (To): Copper wire bonding in SPM3/3V package

(From): Fairchild Semiconductor products, 74AC138, 74AC139, 74ACT138 and 74ACT139 are currently manufactured in South Portland, Maine using a 6-inch
FACT2.0 process.(To): Fairchild Semiconductor will produce these products at wafer Fab CSMC, located in WuXi, China (PRC). The products listed in the FSID list at the bottom of this document will be manufactured on 6 inch wafers using a CS80C process. All current product package materials, dimensions, markings and datasheet specifications will remain unchanged.

 (From): Fairchild (Suzhou) in China  (To): GEM (Shanghai) in China

(From): LMV324 and LMV358 is currently Assembled and Tested at Carsem (To): To qualify Assembly and Test at Penang

 (From): Current assembly location: ChipPAC, Malaysia  (To): Alternate assembly location: Suzhou, China

(From): Change in carrier tape dimension from Ao = 1.67 +/- 0.05 mm, Bo = 1.17 +/- 0.05
(To): Change in carrier tape dimension to Ao = 1.63 +/- 0.05 mm, Bo =1.12 +/- 0.05 mm

(From): Mold Compound Sumitomo G770 (To): Mold Compound Nitto GE-100-LFC-S

 (From): SOT-89 Lead frame pad with hole. (To): SOT-89 Lead frame pad without hole.

(From): The original location of JCET SOT223 assembly line: No 275, Binjiang Rd. M, Jiangyin, Jiangsu, P.R.C (To): The proposed new location of JCET SOT223 assembly line: No 78 Changshan Rd. Jiangyin, Jiangsu, P.R.C

(From): Adding Fairchild Assembly site in Penang, Malaysia as alternate
Assembly site for Signetic, Korea. (To): Qualify Fairchild Assembly site in Penang, Malaysia to assemble and test 20 lead SOP and 20 lead SOIC package

(From): 8-pin DIP coplanar construction  (To): 8-pin DIP over-under construction

(From): See details in Change From table (To): See details in Change To table

(From): STATS ChipPAC in Malaysia (To): STATS ChipPAC in Malaysia and Fairchild Suzhou China

 (From): Die attach method: Two chip die attach Wire size & QTY : 20mil *2ea per chip Ass'y site for TO-220F: SP. (To): Die attach method: Dual chip die attach Wire size & QTY :
15mil*1ea per chip Ass'y site for TO-220F: SP

(From): Current assembly and test site: SCM - ChipPAC, Malaysia. To change from single 15mil wire-bond. (To): Alternate assembly and test site: FSSZ - Suzhou, China. To single
20mil wire-bond.

(From): Fairchild will change the cover tape used in packaging BGA
devices to a Pressure Sensitive Adhesive (cold seal).
(To): To a cover tape with Heat Activated Adhesive (heat seal). The
supplier for carrier and cover tapes will also be changed from 3M to SPT but the carrier tape dimensions will remain the same.

(From): Current Assembly site: STATSChipPAC, Shanghai
 (To): Alternate Assembly site: Fairchild, Malaysia

From): Change in carrier tape pocket hole dimension from 1.0 mm (To): Change in carrier tape pocket hole dimension to 0.8 mm.

(From): Fairchild Semiconductor products, 74AC245 and 74ACT245 are currently manufactured in South Portland, Maine using a 6-inch FACT2.0 process.(To): Fairchild Semiconductor will produce these products at wafer Fab, CSMC, located in WuXi, China (PRC). The products listed in the FSID list at the bottom of this
document will be manufactured on 6 inch wafers using a CS80C process. All current product
package materials, dimensions, markings and datasheet specifications will remain unchanged.

 (From): PanJIT Electronics International Inc. (To): Taiwan Semiconductor Co., Ltd

Fairchild issued an initial company-wide PCN to all customers of record announcing the transition to Pb-free products on July 11, 2003 (PCN # 20032701). In that notification, the following statement was made, “The manufacture of products with tin-lead plating will be completely discontinued as products with lead-free finish are introduced. After the transition period, Fairchild's standard products will only be available with a lead-free finish”. An additional notification was sent to all customers of record on May 24, 2004 (PCN # 20032701-A) which stated, “As each package type is converted, the manufacture of products with traditional SnPb plating will be completely discontinued. After the transition period, Fairchild’s standard products will only be available with a Pb-free finish”. As stated on the Pb-free section of Fairchild’s website, “Fairchild's goal is to transition all customers to Pb-free products. We do understand that for various reasons, some customers will not be ready to convert to Pb-free processing at this time. Fairchild will help these customers by continuing a supply of SnPb products for as long as manufacturing capability and viable customer demand exists. However, many of our manufacturing facilities and partners no longer have the ability to provide SnPb plating. Several others are likely to eliminate SnPb plating by the end of calendar year 2006. It is likely that our ability to provide SnPb plated products after the beginning of 2007 will be limited”. Since the conversion to Pb-free, Fairchild has continued efforts to support customers with SnPb products whenever possible. However, the overwhelming acceptance of Pb-free products has led to a greatly reduced demand for SnPb devices and it is becoming increasingly difficult to source these parts. At this time Fairchild can no longer commit to a continued supply and must follow through on the previous customer notifications to completely discontinue the support for SnPb products.