2008 Product Change Notification (PCN)

(From): Currently PAC TECH USA Inc., located in Santa Clara, CA is the only available location for Electroless Nickel Gold (ENIG) processing. (To): To allow both PAC TECH USA Inc. and FCI (FlipChip Millennium Co., Ltd.), located in Pudong, Shanghai, for Electroless Nickel Gold (ENIG) processing.

(From): Selected MOSFET products currently assembled in Power 56 package at Fairchild Semiconductor in Cebu, Philippines. Current singulation method is Saw Singulation; current plating finish is NiPdAu; and current Die Attach Pad & Leadpost plating is NiPdAu. To view"From/To" Marketing Outline Dimensions, please refer to the attached table "Marketing Outline Dimensions." (To): Selected MOSFET products assembled in Power 56 package will also be assembled at GEM Shanghai, China. The alternate singulation method will be Punched Singulation; alternate plating finish will be Pure Sn; and alternate Die Attach Pad & Leadpost plating will be Bare Cu.

(From): FS50 process technology is qualified on 150 mm and 200 mm wafers. The Fine Line (FL) superstructure on the FS50 process is qualified for 150 mm wafers diameter. (To): Convert the Fine Line (FL) process variant of the FS50 process to 200 mm wafers diameter.

(From): Fairchild products currently manufactured using Fairchild's 150mm class 1 fab process in South Portland, Maine. The 42-ball BGA package currently used by Fairchild is RoHS compliant. (To): Products will now be produced on 200mm wafers at the Fairchild Semiconductor South Portland, Maine fab. The 42-ball BGA package in addition to being RoHS compliant is now fully green compliant. Die size, design, geometry and layout of the affected products remains unchanged. The products will be fully compliant to all published datasheet specifications. Quality and reliability will remain at the highest standards already demonstrated with Fairchild's existing products.

(From): WL_CSP FS50 Die Processing at Fairchild-Penang: 150 mm diameter wafers. (To): WL_CSP FS50 Die Processing at Fairchild-Penang: 150 mm and 200 mm diameter wafers.

(From): Optoelectronics detector devices currently fabrication at China Resources Semiconductor. (To): Optotelectronics detector devices will also be fabricated at the Fairchild Semiconductor 6" fabrication facility located in South Portland, Maine. The South Portland die will be an alternate source to the detector die currently used in the effected FSID list. Product using die from the alternate source will be fully compliant to all published databook specifications and will be interchangeable with the existing product. Quality and reliability will remain at the highest level already demonstrated with Fairchild existing products.

(From): Increase tube length from 496mm and box length from 523mm. (To): to tube length of 518mm and box length of 543mm. Affected parts are fully compliant to all publish databook specification and interchangeable with existing products.

(From): Selected Intellimax products currently manufactured using the 6-inch line at Fairchild Semiconductor, South Portland, Maine. (To): Selected Intellimax products will be also manufactured using the 8-inch line at Fairchild Semiconductor, South Portland, Maine.

(From): TO3PF 3 Leads product is currently manufactured at SP Semiconductor & Communication Co Ltd. located in Korea using materials referenced in table 1. (To): TO3PF 3 leads product will be manufactured at Fairchild Semiconductor located in Suzhou, China using materials referenced in table 1. Changes in soft solder die attach material, Leadframe base materials and lead finish plating bath have been made to align with standard materials and process currently utilized in FSC, Suzhou Manufaturing line. Package outline drawing of the affected products remains un-changed. Product will be fully compliant to all published data sheet specifications and will be interchangeable with current material. Quality and reliability will remain at the highest standards already demonstrated with Fairchild's existing products.

(From): Package retract pin hole shape Retract pin D=1.4mm. (To): BUSH type for retract pin hole D(with bush)=2.0mm, D(pin)=1.0mm.

(From): SC70 package assembly in FSC approved manufacturing location (FSCP) using non Green mold compound as shown in table 1: (To): SC70 package assembly in FSC approved manufacturing location (FSCP) using Green mold compound as shown in table 2:

(From): StatsChipPAC (Kuala Lumpur, Malaysia) e (To): Fairchild Semiconductor (Suzhou, China)

(From): 1. D2PAK/I2PAK 2 and 3 Leads are currently being manufactured at SPS (SP Semiconductor & Communication Co Ltd) located in Korea. 2. Package outline did not confirm to JEDEC requirement. (To): 1. Qualify Fairchild Semiconductor located in Suzhou, China as a new Assembly and Test manufacturing site for D2PAK/I2PAK 2 and 3 leads. 2. New qualified package outline will confirm to JEDEC requirement.

(From): TO220 2 and 3 Leads are currently being manufactured at SPS (SP Semiconductor & communication Co Ltd)/ENOCH located in Korea. (To): Qualify Fairchild Semiconductor located in Suzhou, China as an additional Assembly and Test manufacturing site for TO220 2 and 3 leads.

(From): Lead frame vendor: Mitsui Hitec/Samsung Techwin/Poongsan Philippine. (To): Lead frame vendor: Mitsui Hitec/Samsung Techwin/Poongsan Philippine and Ningbo Kangqiang Electronics Co.,Ltd.(china)

(From): TO3P 3 Leads is currently being manufactured at SPS (SP Semiconductor & Communication Co Ltd) located in Korea. (To): 1. Qualify Fairchild Semiconductor located in Suzhou, China as a new Assembly and Test manufacturing site for TO3P 3 leads package, and comply with Suzhou current TO3PN 3 leads package. 2. Suzhou assembled TO3PN 3 leads package has one difference from the existing TO3P 3 leads package, but meet the EIAJ dimensional standards. (refer to below detail POD comparison)

(From): 1. TO220F 6 Leads are currently being manufactured at Fairchild Semiconductor Co Ltd. located at Cebu in Philippines. (To): 1. Qualify Fairchild Semiconductor Co Ltd. located in Suzhou as an alternate Assembly and Test manufacturing site for TO220F 6 leads. 2. There is no change in BOM 3. There is no change in package outline drawing 4. Product quality and reliability is not impacted.

This notification letter is to inform Fairchild Semiconductor Corporation's customers of our Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support.

(From): Dpak with heatsink protrusion and Dpak with flat heatsink are not combined in one reel per lot. (To): Dpak with heatsink protrusion and Dpak with flat heatsink will be combined in one reel per lot. The heatsink dimensions are within marketing specs. Reason for Change :

(From): Electrical Characteristics (Ta = -40C to 85C) for If(off) Control Current for Off-State Resistance. (To): Electrical Characteristics (Ta = 25C) for If(off) Control Current for Off-State Resistance

(From): SSOT-3 and SSOT-6 package assembly in FSC approved manufacturing locations using non-Green mold compound as shown in table 1: (To): SSOT-3 and SSOT-6 package assembly at all FSC approved manufacturing locations using Green mold compound as shown in table 2:

(From): Current wafer and die sales Assembly Site: STATSChipPAC MALAYSIA SDN BHD (SCM) at 73, Lorong Enggang ulu Kelang FTZ, 54200 Kuala Lumpur, Malaysia. (To): New wafer and die sales Assembly Site: FAIRCHILD SEMICONDUCTOR (PHILIPPINES), INC. (FSCP) at MEPZ, Lapu-lapu City, Cebu Philippines 6015.

(From): Affected products assembled and tested in TO92 package at ASE (WeiHai) Company and AUK (DaLian) Company (To): Jiangsu Changjiang Electronics Technology (JCET) in China is being qualified as an additional TO92 package assembly/test site, Changes in package BOM are detailed in the following tables. Affected products will be fully compliant to the existing Fairchild Marketing outline drawing (MKT-ZA03D (TO92-3L straight lead) and MKT-TO92J61Z (TO92-3L Ammo style formed lead)) and all current published data sheet specifications. Product assembled at JCET will be interchangeable with current product. Quality and reliability will remain at the highest standards already demonstrated with Fairchild's existing products.

(From): SOIC-8 FLMP, SSOT-6 FLMP and SC75-6L FLMP package assembly in FSC approved manufacturing locations using non-Green mold compound as shown in table 1: (To): SOIC-8 FLMP, SSOT-6 FLMP and SC75-6L FLMP package assembly in FSC approved manufacturing locations using Green mold compound as shown in table 2:

(From): Aimhigh global corp. in Korea. (To): SP Semiconductor & Communication Co., Ltd. in Korea. It's also certified for TS16949 and ISO14001.

(From): Optoelectronics detector devices utilized in the assembly of the attached affected products are currently fabricated at China Resources (CRS) 4 inch fabrication facility located in Hong Kong, China. (To): Optoelectronics detector devices utilized in the assembly of the attached affected products will be fabricated at CRS 6 inch fabrication facility located in Wuxi, China. There will be no detector device, design, die size or die thickness changes for the affected FSID's. Product assembled with detector die manufactured at Wuxi facility will be fully compliant to all publish databook specifications and will be interchangeable with products manufactured at the existing wafer fab location. Quality and reliability will remain at the highest levels already demonstrated with Fairchild existing products.

(From): D/I PAK 2 and 3 Leads are currently being manufactured at SPS (SP Semiconductor & Communication Co Ltd) located in Korea. (To): Qualify Fairchild Semiconductor located in Suzhou, China as a new Assembly and Test manufacturing site for D/I PAK 2 and 3 leads. Reason for Change : 1. Qualification of new manufacturing site to improve capacity flexibility

(From): 8L MLP3x3 package assembly at all FSC approved manufacturing location(s) (Carsem) using non Green mold compound as shown in table 1. (To): 8L MLP 3x3 package assembly at all FSC approved manufacturing location(s) (Carsem) using Green mold compound as shown in table 2.

(From): Wafer fabrication: FSME ( USA ) Wafer Bump: Amkor K4 (Korea) Backgrind: Amkor T3 ( Taiwan ) Die processing: Amkor T3 ( Taiwan ) or FSPM ( Malaysia) (To): Wafer fabrication: FSME ( USA ) Wafer Bump: Amkor K4 (Korea) Backgrind: Amkor T3 ( Taiwan ) or FSPM (Malaysia) Die processing: Amkor T3 ( Taiwan ) or FSPM ( Malaysia)

(From): Selected Tiny Logic 5-lead ULP/ULP-A devices manufactured on South Portland FS35C Fab process line and assembled in Micropak at Hana or ASEM and in SC-70 packages. (To): The same Design schematics are used but the die will be revised to add bond pad over active layer. For the Micropak package, Fairchild Malaysia (FSPM) will be added as an additional assembly location.

(From): Selected Mosfet products currently manufactured using the 8-inch line in Mountain Top, PA. The backmetal for the affected products is being changed from 5KA, 3KA, 3.5KA, 20KA (AL-Ti-Ni-Ag). (To): Selected Mosfet devices currently fabricated at Fairchild Semiconductor 8-inch line in Mountain Top, PA, USA will be also manufactured at Advanced Semiconductor Manufacturing Corporation (ASMC), the 6-inch facility for wafer fabrication located in Shanghai, China. The backmetal of these selected devices is being changed to 3KA, 2KA, 10KA (Ti-Ni-Ag). The new backmetal, Ti-Ni-Ag, is a standard backmetal system used on other qualified MOSFET products. There will be no additional change to the die layout, die size, geometry, substrate, assembly and packaging, product datasheet, performance and function of any affected devices. Quality and reliability will remain at highest standard.

(From): StatsChipPAC (Kuala Lumpur, Malaysia) (To): Fairchild Semiconductor (Suzhou, China)

(From): StatsChipPAC (Kuala Lumpur, Malaysia) (To): Fairchild Semiconductor (Suzhou, China)

(From): Selected MLP 8x8 products currently manufactured at Polar Semiconductor using the 8-inch process. Polar Semiconductor is located at 2800 East Old Shakopee Rd., Bloomington, MN 55425. (To): Products will now be produced both at Polar Semiconductor as well as at Jazz Semiconductor using 8-inch process. Jazz Semiconductor is located at 4321 Jamboree Rd., Newport Beach, CA 92660 (ISO9001, ISO14001, and BS7799 certifications).

(From): Fairchild products currently manufactured using Fairchild's 6-inch class 1, fab process in South Portland, ME (To): Products will now be produced on both 6 inch and 8 inch wafer Diameters. Manufacturing will occur in the same 6-inch Class-1 fab currently producing these products. In some cases, new 8 inch equipment will be added to accommodate the 6 to 8 inch processing conversion. Die size, design, geometry, or layout of the affected products remains un-changed. 8 inch products will be fully compliant to all published data sheet specifications and will be completely interchangeable with current 6-inch product. Quality and reliability will remain at the highest standards already demonstrated with Fairchild's existing products.

(From): TO3P 3 Leads are currently being manufactured at SPS (SP Semiconductor & Communication Co Ltd) located in Korea. (To): 1. Qualify Fairchild Semiconductor located in Suzhou, China as a new Assembly and Test manufacturing site for TO3P 3 leads package, and comply with Suzhou current TO3PN 3 leads package. 2. Suzhou assembled TO3PN 3 leads package has one difference from the existing TO3P 3 leads package, but meet the EIAJ dimensional standards. (refer to below detail POD comparison)

(From): UVLO ( Vin rising ) 2.65 V min. UVLO ( Vin falling ) 2.35 V min. (To): UVLO ( Vin rising ) 2.60 V min. UVLO ( Vin falling ) 2.30 V min.

(From): StatsChipPAC (Kuala Lumpur, Malaysia) (To): Fairchild Semiconductor (Suzhou, China)

(From): StatsChipPAC (Kuala Lumpur, Malaysia) (To): Fairchild Semiconductor (Suzhou, China)

(From): SOIC-8 FLMP, SSOT-6 FLMP and SC75-6L FLMP package assembly in FSC approved manufacturing locations using non-Green mold compound as shown in table 1: (To): SOIC-8 FLMP, SSOT-6 FLMP and SC75-6L FLMP package assembly in FSC approved manufacturing locations using Green mold compound as shown in table 2:

(From): Hysol Epoxy and dye material (To): Fairchild is adding Epifine and Richtech as epoxy and dye material suppliers. All of the epoxy and dye materials are qualified to be used interchangeably. There is no difference in the form, fit, function or manufacturability of the devices when either the Hysol material or the alternate materials are used for assembly

(From): Affected products assembled and tested in SOT89 package at AUK in Korea (To): Jiangsu Changjiang Electronics Technology (JCET) in China is being qualified as an additional SOT89 package assembly/test site. Changes in package BOM are detailed in the following tables. Affected products will be fully compliant to the existing Fairchild Marketing outline drawing (MKT-MA03C) and all current published data sheet specifications. Product assembled at JCET will be interchangeable with current product. Quality and reliability will remain at the highest standards already demonstrated with Fairchild's existing products.