October 2004 Product Change Notification (PCN)
| PCN# | PCN Date | Description of Change | Notification |
| 20044104 | 10/18/2004 | Die Attach Material | 20044104.rtf |
| 20043702 | 10/14/2004 | Assembly Process | 20043702.rtf |
| 20041804-A | 10/12/2004 | Alternate Assembly/Test Location/Qualification | 20041804-A.rtf |
| 20043602 | 10/12/2004 | Assembly Process | 20043602.rtf |
| 20042304 | 10/12/2004 | Manufacturing Location | 20042304.rtf |
| 20043804 | 10/11/2004 | Die Revision | 20043804.rtf |
| 20043102 | 10/11/2004 | Alternate Assembly/Test Location/Qualification | 20043102.rtf |
| 20043802 | 10/5/2004 | Die Revision | 20043802.rtf |
| 20043505 | 10/5/2004 | Bond Wire Material Composition | 20043505.rtf |
| 20042606 | 10/1/2004 | Databook Secifications | 20042606.rtf |
Note: for more product change notification customer letters, please visit PCNalert.com (exiting Fairchild)
