2006 Product Change Notification (PCN)

 (From): Support Pin On DBC (To): Support Pin On Lead Frame.

Change Type : Marking Format or Content
(From): Current Marking / Flow code
 (To): Aligned Marking / Flow code

Change Type: Data Book Specifications
(From): HFE @ Vce=5V, Ic=2A >300
(To): HFE @ Vce=5V, Ic=1.5A >300 HFE @ Vce=5V, Ic=2A >200

 Description of Change (From): Fairchild Semiconductor 8-inch fab line in Mountaintop,
Pennsylvania and Fairchild Semiconductor Cebu Philippines assembly/test site and
STATSChipPAC subcon assembly/test facility. For reference facility addresses are as follows:
Fairchild Semiconductor Crestwood Industrial Park 125 Crestwood Road Mountain Top,
PA,18707. Fairchild Semiconductor MEPZA, Lapulapu City Cebu, Philippines
STATSChipPAC Malaysia Sdn. Bhd 73, Lorong Enggang, Ulu Kelang FTZ 54200 Kuala
Lumpur, Malaysia
Description of Change (To): Fairchild Semiconductor QS 9000 approved Bucheon, Korea
facility for wafer fabrication and Fairchild Semiconductor TS16949 certified Suzhou, China
assembly/test site. Note, the following two devices are not included in the assembly transfer.
HUF75345P3_R4908(TO-220) & HUFA75343P3_F085(TO-220). For reference facility
addresses are as follows: Fairchild Semiconductor (420-711) 82-3 Todang-Dong
Wonmi-District Bucheon City, Kyonggi Province Korea, Fairchild Semiconductor 1 Sutong
Road, China-Singapore Suzhou Industrial Park Suzhou, Jiangsu P. R. of China.

Q3063202

10/19/2006

(From): Non passivation (To): The passivation layer, Nitride will be added on the die of Sene FET(ED5D65X)

Q2062101

10/19/2006

(From): Current manufacturing location at Fairchild Semiconductor Malaysia Sdn. Bhd. and Hana Semiconductor Thailand. (To): Carsem Malaysia Sdn. Bhd. facility is being added as an additionalmanufacturing site for SC70 package types upon successful completion of Fairchild'squalification process. Fairchild Semiconductor Malaysia Sdn. Bhd. and Hana Semiconductor Thailand sites will continue to produce SC70 devices.

Wire bond material change from gold (Au) wire to copper (Cu) wire for Functional Power Group SO-8 devices manufactured in subcontractor site in Amkor Technology. There is no change in the wire diameter, type of thermosonic bonding process, marking, and part names of all affected parts. Products will be shipped for an interim period of time with Au wire until the inventory is depleted and then converted fully to Cu wire. Amkor is TS-16949 certified.

Fairchild Semiconductor is qualifying Nantong-Fujitsu Microelectronics, based in Nantong, Jiangsu Province, China as the out-source assembly and test location for NMDIP package types that are currently assembled and tested in Fairchild Malaysia facility. These NMDIP products will be completely out-source to Nantong upon successful completion of Fairchild's qualification process. Nantong-Fujitsu Microelectronics is ISO9001:2000, QS9000 and ISO14001 certified.

Q2062502

8/21/2006

Assembly Site Transfer Qualification of AMKOR Lead-Free LQFP-48 Package With Fairchild SCG Products

The FAN5608 LED driver and its derivative products currently manufactured by FAIRCHILD Semiconductor may be damaged when a fully loaded channel is momentarily disconnected. In order to avoid this accidental damage, an external zener diode ( Vz = 20 V ) clamp must be connected between Vout and GND.

Q2062001

7/11/2006

(From): The circuit to detect "on the fly" VID changes is enabled through the TD3 state. (To): Through the end of the TD3 state, the circuit to detect "on the fly" VID changes is bypassed. This change is fully transparent to the users of previous CPU models ( Dempsey, Smithfield ).

The FAN5608 LED driver and its derivative products currently manufactured by FAIRCHILD Semiconductor may be damaged when a fully loaded channel is momentarily disconnected. In order to avoid this accidental damage, an external zener diode ( Vz = 20 V ) clamp must be connected between Vout and GND.This LED driver has been redesigned to eliminate  the  susceptibility to self destroy when a channel is "opened".

Fairchild Semiconductor is qualifying Nantong-Fujitsu Microelectronics, based in Nantong, Jiangsu Province, China as an alternate assembly and test location for 8-DIP, 14-DIP, 8-SOP and 14-SOP package types that are currently assembled and tested in Fairchild Korea Semiconductor Ltd facility.  Nantong-Fujitsu Microelectronics is ISO9001:2000, QS9000 and ISO14001 certified.  Fairchild will also continue to assemble and test 8DIP, 14DIP, 8SOP and 14SOP products using existing qualified suppliers such as STS in Korea, Chippac Shanghai, PSTS and SZEC in China.

10SSOP will  transfer package assembly and test site  from STS in Korea to PSTS in China.PSTS (Phoenix Semiconductor Telecommunication (suzhou) CO., LTD) in China is same company with STS.PSTS (Phoenix Semiconductor Telecommunication (suzhou) CO., LTD) in China will be qualified as an alternative assembly and test site for Fairchild's devices packaged in the 10SSOP package.

Existing products which is using Ablebond 8006 will be affected by the change.Fairchild Semiconductor is qualifying epoxy Ablebond 8006NS.

Fairchild has included the words "LEAD FREE" on labels placed on reels and internal boxes for all products that are compliant to the European Union directive on the Restriction of Hazardous Substances, 2002/95/EC, commonly referred to as RoHS.  In order to provide more useable information to our customers, Fairchild will be phasing in new labels that provide a more accurate indication of compliance to RoHS.  As this change is made, the words "LEAD FREE" will be removed from the standard reel and box labels.  A new RoHS symbol, shown below, will be added as a replacement to all labels, including external shipping labels.

Fairchild is announcing the qualification of the following assembly site to augment the production of the affected devices due to the increased demand. This added capacity will allow Fairchild to operate more efficiently and better serve our customers.

Changes made onthe following:

1.) Reduced and even out tie bar thickness.

2.) Reduced waffle depth and area.

3.) Removed Index Slot at marking side.

These devices are currently manufactured in Fairchild's qualified subcontractors with non Pb-free plating. Fairchild is qualifying those devices in Pb-free plating with some changes in bill of materials. This change is being implemented to supply the devices with Pb-free plating by maintaining its existing MSL level at lead-free reflow peak temperatures (260C for LQFP and MQFP, 245C for PLCC). These products will meet Fairchild's published data book specifications.

Fairchild Semiconductor is qualifying Nantong-Fujitsu Microelectronics, based in Nantong, Jiangsu Province, China as the out-source assembly and test location for NMDIP package types that are currently assembled and tested in Fairchild Malaysia facility.These NMDIP products will be completely out-source to Nantong upon successful completion of Fairchild's qualification process.Nantong-Fujitsu Microelectronics is ISO9001:2000, QS9000 and ISO14001 certified.

Current marking of SMA Schottky devices uses the notch and bar as identifier for the location of the cathode pin.  Other packages in SMD, such as SMB and SMC use  the  cathode bar only as the identifier.  With the aim for standardization, the notch will be removed and the use of one single bar as the indicator for cathode for the SMA package.

Fairchild Suzhou, in China, will be qualified as an alternative assembly and test site for devices packaged in the TO-3P package.  Fairchild Suzhou is a TS16949 certified manufacturing facility that is already qualified to produce the TO-220, DPAK, IPAK, TO-3PF-5L and the TO-3PF-7L packages for Fairchild.All dimensions of the Suzhou assembled TO-3P package meet the EIAJ dimensional standards, but there will be one difference between the existing TO-3P package and the new package from Fairchild Suzhou.  The package lead to heatsink backside distance will increase from a nominal dimension of 1.40mm on the existing TO-3P package to a nominal dimension of 2.40mm on the Fairchild Suzhou package.

PSTS (Phoenix Semiconductor Telecommunication (Suzhou) CO., LTD) in China, an ISO9001 certified manufacturer,  is being qualified as an alternative assembly and test site for MOSFET and IGBT devices packaged in the 8-lead SOP. PSTS is part of the same company as STS in Korea, the current assembly and test site for these products.

Fairchild Semiconductor is announcing an additional wafer fab location for the processing of FACT devices. These devices are currently manufactured in Fairchild's 6-inch wafer fab located in South Portland, ME. The additional manufacturing facility will be CSMC's 6-inch CS80C wafer fab located in WuXi, China (PRC).

A part of ESD diode in VFB(#3) is changed to improve surge level of the VFB(#3)

1) CHANGE  ESD DIODE

the bottom of ESD diode in FB(#3) was cut and connected with the bottom of ESD diode  in OPT (OPTION PAD)

2) Bonding revision

According to this change, bonding method was changed from one bonding to two bonding.

As part of Fairchild Semiconductor's on-going effort to increase its manufacturing capacity for primary Bipolar products in SOT23 package, we have qualified Fairchild Bucheon as alternate die source for SOT-23 products.This Fairchild Bucheon wafer fabrication site is located at 82-3 Dodang-dong, Wonmi-gu, Bucheon-si, Gyeonggi-do, Korea. This is intended to meet additional demand for these selected Bipolar products in SOT23 package by having additional flexibility in die source.

Fairchild Semiconductor DO-35 package is currently assembled and tested in one of its subcontracting plants, Tak Cheong Electronics, located in Shanwei, Guangdong, China.  As part of Fairchild Semiconductor's on-going efforts to develop cost effective products, we are already in the Phase 2 in the qualification of this new DO-35 package dimension.  This is already implemented in all switching diode parts built in DO-35 package using the D3D die.  Expected changes are as follows:

To further augment the capacity and  delivery support, Panjit International located in Wuxi, China was qualified as a new  assembly and test site  for Axial packages currently built in  Panjit International located in Shenzhen China. There is no change in package specifications, bill of  materials, processes and  marking format, aside from the location of the manufacturing site. 

20060601

2/15/2006

These products are currently fabricated at Chartered Semiconductor Manufacturing (CSM) in a 150 mm wafer process in Fab-1 located in Singapore. CSM has decided to obsolete the 150 mm wafer fab and transfers these products to a 200 mm wafer process in Fab-2 also located in Singapore.

The passivation layer, Nitride, will be added on the die of FQA6N90C, FQP6N90C and FQPF6N90C.

Fairchild is announcing the qualification and subsequent approval of the following assembly site to augment the production of the affected devices as a result to increased demand. The added capacity will allow Fairchild to operate more efficiently and better serve our customers.

The FAN5608 LED driver and its derivative products currently manufactured by FAIRCHILD Semiconductor may be damaged when a fully loaded channel is momentarily disconnected. In order to avoid this accidental damage, an external zener diode ( Vz = 20 V ) clamp must be connected between Vout and GND.This LED driver has been redesigned to eliminate the susceptibility to self destroy when a channel is "opened".

Fairchild is announcing the qualification of the following assembly sites to augment the production of the affected devices due to the increased demand. This added capacity will allow Fairchild to operate more efficiently and better serve our customers.

Package Lead count Additional Assembly Sites

Micropak 6 Hana (BT), Fairchild Malaysia (BT)

Micropak 8 Hana (BT), Fairchild Malaysia (BT)

As part of Fairchild Semiconductor's effort to increase materials supply flexibility of our SPM package and to improve customer service, we are qualifying alternative molding compound, as alternate/additional assembly materials to SPM packages.

Fairchild will switch all its LED products using the 2 or 3 elements die (ex: GaP, GaAsP) to the 4 elements.

Fairchild Semiconductor has qualified MLP3x3 package with sawn singulation process at Fairchild's qualified subcontractor, Carsem and Amkor. This qualification has been announced in PCN 20043602 and PCN 20042304 respectively.This PCN is to announce that additional leadframe design for MLP3x3 is available in Carsem and qualification is underway.Please refer to the marketing outline drawing below.In line with the additional leadframe design availability, the products associated with this PCN will also be available in NiPdAu preplated leadframe and will include a change to the die attach epoxy and the mold compound, or plastic encapsulant.

As part of Fairchild Semiconductor's effort to increase and secure a future available capacity and ensure a reliable second source, GEM Electronics Co. Ltd., located in Shanghai, China is being qualified as an additional assembly, test and finishing subcontractor for MosFet BGA Cu Bump package.This change is intended to meet additional demand for various products in this package, improve cycle time and service to customers.These products are currently assembled and tested in Fairchild Semiconductor, Cebu, Philippines.

The wide-body SOIC package manufactured for Fairchild by Amkor Technologies in the Philippines (ATP) and the 8-lead SOIC package manufactured for Fairchild by NSEB in Thailand are currently rated as Moisture Sensitivity Level 1 (MSL1) and do not require dry packing.These packages are not able to maintain an MSL1 rating at the higher reflow temperatures required for Pb-free processing. As such, they have been reclassified as MSL3 for the wide-body SOIC and MSL2 for the 8-lead SOIC from NSEB. Initial Pb-free versions of these products will be manufactured with the currently qualified package materials and will be shipped in appropriate moisture barrier bags, also known as dry pack. This notification is being sent only to notify you of a change to the packing method.Fairchild is working with our subcontractors to qualify new package materials that will bring these products back to an MSL1 rating, even at Pb-free processing temperatures. The change to package materials was previously announced in PCN 20051106 and qualifications are underway. A final PCN announcing the satisfactory conclusion of the material change will be sent upon completion of these qualifications. At that time, these products will no longer require moisture barrier bags.

In addition to the conversion to lead-free plating by using NiPdAu pre-plated frames, the TSSOP-14, -16, -20 and -24 Analog Video Filters products associated with this new PCN will also include a change in die-attached epoxy and mold compound.These devices can be easily identified by (i) the change in year date code from numeric to alpha character as a designation of lead-free product and (ii) the change in the first character of the die run code as a designation of pre-plated frames assembly process.