This device is designed specifically as a single package solution for the battery charge switch in cellular handset and other ultra-portable applications. It features two independent P-Channel MOSFETs with low on-state resistance for minimum conduction losses. When connected in the typical common source configuration, bi-directional current flow is possible.The MicroFET 2x2 package offers exceptional thermal performance for it's physical size and is well suited to linear mode applications.
| Product | Product & Eco Status | *Pricing | Packaging & Packing Info | **Package Marking Convention | Qualification Support | Compliance Certificates |
|---|---|---|---|---|---|---|
| FDMA1027P |
Full Production Green as of Dec 2006 |
$0.406 | MLP 2x2 6L (MicroFET) Details TAPE REEL |
Line 1:&E (Space) &Y (Binary Calendar Year Coding) Show more... |
FIT :
0.8
ESD (CDM) : 2000 V ESD (HBM) : 200 V Show more... |
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| Application Note | Description |
|---|---|
| AN-7533 | A Revised MOSFET Model With Dynamic Temperature Compensation(132 K) 05-Mar-2011 |
| AN-6099 | New PowerTrench® MOSFET with Shielded Gate Technology Increases System Efficiency and Power Density in Synchronous Rectification Applications(1,172 K) 12-Mar-2013 |
| AN-9065 | FRFET® in Synchronous Rectification(156 K) 14-Feb-2013 |
| AN-558 | Introduction to Power MOSFETs and their Applications(244 K) 03-May-2013 |
| AN-9005 | Driving and Layout Design for Fast Switching Super-Junction MOSFETs(1,778 K) 14-Feb-2013 |
| AN-7510 | A New PSPICE Subcircuit for the Power MOSFET Featuring Global Temperature Options(222 K) 05-Mar-2011 |
| AN-9010 | MOSFET Basics(361 K) 05-Mar-2011 |
| AN-9055 | Assembly Guidelines for MicroFET™ 2x2 Dual Packaging(568 K) 08-Apr-2011 |
| AN-9053 | Assembly Guidelines for MicroFET 2X2 Packaging(136 K) 27-Feb-2013 |