This device is designed specifically for battery charge or load switching in cellular handset and other ultraportable applications. It features a MOSFET with low on-state resistance and zener diode protection against ESD. The MicroFET 2X2 package offers exceptional thermal performance for its physical size and is well suited to linear mode applications.
| Product | Product & Eco Status | *Pricing | Packaging & Packing Info | **Package Marking Convention | Qualification Support | Compliance Certificates |
|---|---|---|---|---|---|---|
| FDMA910PZ |
Full Production Green as of Jun 2011 |
$0.363 | MLP 2x2 6L (MicroFET) Details TAPE REEL |
Line 1:&E (Space) &Y (Binary Calendar Year Coding) Show more... |
FIT :
5.6
ESD (HBM) : 2800 V RTHETA (JA) : 52 °C/W Show more... |
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| Application Note | Description |
|---|---|
| AN-7533 | A Revised MOSFET Model With Dynamic Temperature Compensation(132 K) 05-Mar-2011 |
| AN-9065 | FRFET® in Synchronous Rectification(156 K) 14-Feb-2013 |
| AN-7510 | A New PSPICE Subcircuit for the Power MOSFET Featuring Global Temperature Options(222 K) 05-Mar-2011 |
| AN-558 | Introduction to Power MOSFETs and their Applications(244 K) 03-May-2013 |
| AN-9005 | Driving and Layout Design for Fast Switching Super-Junction MOSFETs(1,778 K) 14-Feb-2013 |
| AN-9010 | MOSFET Basics(361 K) 05-Mar-2011 |
| AN-6099 | New PowerTrench® MOSFET with Shielded Gate Technology Increases System Efficiency and Power Density in Synchronous Rectification Applications(1,172 K) 12-Mar-2013 |
| AN-9055 | Assembly Guidelines for MicroFET™ 2x2 Dual Packaging(568 K) 08-Apr-2011 |
| AN-9053 | Assembly Guidelines for MicroFET 2X2 Packaging(136 K) 27-Feb-2013 |
For additional information please visit the Models page.
| Package | Condition | Temperature Range | Vcc Range | Software Version | Revision Date |
|---|---|---|---|---|---|
| PSPICE | |||||
| MLP 2x2 6L (MicroFET) | Electrical | -55°C to 150°C | N/A | Orcad 16.3 | Mar 13, 2012 |