The FDMF8704 is a fully optimized integrated Driver plus MOSFET power stage solution for high current synchronous buck DC-DC applications. The device integrates a driver IC and two Power MOSFETs into a space saving, MLP 8x8, 56-pin package. Fairchild Semiconductor’s integrated approach optimizes the complete switching power stage with regards to driver to FET dynamic performance, system inductance and overall solution ON resistance. Package parasitics and problematical layouts associated with conventional discrete solutions are greatly reduced. This integrated approach results in significant board space saving, therefore maximizing footprint power density. This solution is based on the Intel™ DrMOS specification.
|Index||Product||Product & Eco Status||*Pricing||Packaging & Packing Info||**Package Marking Convention||Qualification Support||Compliance Certificates|
Green as of Jan 2007
|$2.76||MLP 8x8 56L (Power 88) Details||
Line 1:$Y (Fairchild logo)
&Z (Plant Code)
&2 (2-Digit Date Code) &T (Die Trace Code)
Moisture Sensitivity Level (MSL) :
Max Reflow Temp : 260
|AN-9037||Assembly Guidelines for 8x8 MLP DriverMOS Packaging(771 K) 05-Mar-2011|
For additional information please visit the Models page.
|Package||Condition||Temperature Range||Vcc Range||Software Version||Revision Date|
|MLP 8x8 56L (Power 88)||Electrical||-55°C to 150°C||N/A||Orcad 15.7||Feb 28, 2012|